Holding device for wet etching one side of semiconductor wafer - having circular support body with central window pressure contact wafer and bayonet locking disc

摘要

Holding device for wet etching one side of a semiconductor plate consists of a circular support body (1) having a central window opening (8) with a recess (91) cut into the back of the window and having a circular groove (72) for locating an O-ring (72). The support body has side walls (4) containing locking grooves (5) and slits (17, 171) which allow the positioning the pressure control plate (2) and bayonet disc (3). The contact plate (2) is pref. circular with a nose (16) and shaft (10) which slide through slits (17, 171) of support body (1). Shaft (10) carries pressure conduit (11) for feeding pressure means to grooves (60,61) housing O-rings (70,71) and depressurising channel 912) for depressurising the areas between grooves (60,61) and central area inside ring groove (61). Another conduit (22) can feed electricity to a contact star (14) in the case of electrochemical etching. The bayonet disc (3) is pushed onto the plate (2) and rotated using grip holes (19) so that lugs (31) are locked in grooves (51). USE/ADVANTAGE - Cleaning, structuring or removing lacquer from one side of conductor plate. Is simple, cheap and reliable.