| 摘要 |
<p>A process and related apparatus for welding the components on printed circuit plates by means of a bath of solder in the melted state, using wave, weir, vibration, static techniques etc., comprising in succession the following phases: fluxing (2), pre-heating (3), at least one washing (4, 5), the possible replacement of solvents (6), additional fluxing (7), possible pre-heating (8), welding (9) and possible mild washing (10), in which the phases from (4) to (8) are carried out in a controlled atmosphere or in a vacuum. <IMAGE></p> |
