| 摘要 |
A method for bonding a rubber substrate to a metal substrate wherein a primer composition is first applied to the surface of said metal substrate and the rubber substrate is then bonded to the primer composition-containing metal substrate surface using a rubber-to-metal bonding adhesive, the improvement comprising employing as the primer composition a mixture comprising an epoxidized diene polymer having a molecular weight of about 500 to 30,000 and a resole type phenolic resin, in a weight ratio of about 2 to 100 parts of said diene polymer per 100 parts of said resole type phenolic resin. |
