RESIN SEALED SEMICONDUCTOR DEVICE

摘要

PURPOSE:To prevent packaging cracking from being produced owing to solder mounting on a wiring board by forming a ceramic coated film on a surface of an island part opposite to the side thereof where a semiconductor device is mounted or opposite surfaces of the same. CONSTITUTION:On the back of an island part 2 a lead frame is prepared which frame is coated with a 10-100mum thick alumina film 8 with the aid of ceramic flame spraying. On a surface of an island part 2 of the lead frame an IC device 4 is mounted through die bonding paste 5, and an inner lead 1a and the IC device 4 are wire-bonded through a gold wire 6. Hereby, package cracking is prevented from being produced owing to solder mounting onto a wiring board.