MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PURPOSE:To provide a thin semiconductor device whose reliability is high in a manufacturing method wherein a semiconductor element and a tape carrier are resin-sealed by a low-pressure transfer method or the like by using a metal mold. CONSTITUTION:A bonding operation is performed in a state that an electrode 13 on a semiconductor element 1 has been brought into contact with an inner lead 11a on a carrier tape 23 or that the inner lead 11a has been raised by the electrode 13. The hanging amount of the inner lead 11a is controlled to 80mum or lower. The inclination of a tape guide 27 supporting the carrier tape 23 is adjusted so as to be parallel with the surface of the semiconductor element 1; a bonding operation is performed; and an irregularity in the hanging amount of the inner lead 11a is controlled to 30mum or lower. The title manufacture is featured in the following manner: an ultralow-viscosity resin whose lowest melting viscosity at an injection molding temperature has been suppressed to 200 poise or lower is used as a sealing resin; and a resin sealing operation is performed by an injection molding operation. In addition, the title manufacture is featured in the following manner: a hole part through which the sealing resin flows easily is made in the lead support part of the carrier tape 23; an irregularity in the position of an upper metal mold and a lower metal mold is suppressed; and a moldfastening amount to the tape is set to 30% or lower of the thickness of the tape.