| 摘要 |
PURPOSE:To manufacture a lamination board for multi-layer printed circuit with favorable dimensional accuracy by making the dimensional change at the time of forming a lamination. CONSTITUTION:A glass cloth having thickness of 0.08-1.1mm as a base material is used, a prepreg 3 having a resin composition of 48-55 % is arranged on the side of metal foil 1, a glass plate having thickness of 0.18-2.1mm is used, and a prepreg 2 having resin component of 38-45 % is arranged on the side of inside layer circuit board 4 to be heated and pressurized. |
