| 摘要 |
PURPOSE:To obtain an optical semiconductor device, which has a small internal stress and is superior in transparency, by a method wherein an optical semiconductor element is sealed using an epoxy resin composition, which consists of a transparent expoxy resin, an acid anhydride curing agent, a curing catalyst and rubber particles of a specified particle diameter. CONSTITUTION:In this epoxy resin composition, it is desirable to use a bisphenol epoxy resin or a cycloaliphatic epoixy resin as a transparent epoxy resin and a colorless or light-yellow acid anhydride, such as a hexahydro acid phthalic anhydride, is used as an acid anhydride curing agent. As a curing catalyst, a tertiary amine, an imidazole compound, organometallic complex salt or the like is exemplified. Specified rubber particles must be ones of a particle diameter of 0.2mum or smaller. Moreover, it is specially desirable to use ones of a particle diameter of 0.05 to 0.1mum and a methacrylic acid methyl-butadiene- styrene rubber is desirable as the component of the rubber particles. Thereby, an optical semiconductor device is superior in light transmission properties and the external stress of the device is reduced. |
