| 摘要 |
PURPOSE:To efficiently perform an electronic component securing work by interposing thermoplastic adhesive between the component and a printed board so as to solder the component to the board. CONSTITUTION:After an electronic component 102 is inserted to a printed board 103, a ringlike thermoplastic adhesive 101 is so inserted as to surround the component 102. It is passed through a solder tank in this state, the adhesive 101 is melted, the adhesive is again cured after it is passed through the tank, thereby securing the component. Thus, in the steps of inserting and soldering the component, the component can be secured, and manhours for correcting can be reduced. |
