发明名称 WIRE LOOP BENDING INSPECTION METHOD AND DEVICE
摘要 PURPOSE:To enhance the measurement precision and workability in the bending inspection on the plane of a wire loop. CONSTITUTION:In a bonding station, a wire 3 to be measured is described on a monitor. Next, the scale marks 42 centered on the point of intersection of both straight lines 40, 41 are displayed on the other straight line 41 orthogonal to the bonding point straight line 40 connecting the first bonding point 3a to the second bonding point 3b. Finally, the title wire loop bending can be measured by reading the scale marks 42.
申请公布号 JPH04330757(A) 申请公布日期 1992.11.18
申请号 JP19910029016 申请日期 1991.01.31
申请人 SHINKAWA LTD 发明人 YAMAZAKI NOBUHITO;KUMAZAWA SHINICHI
分类号 G01R31/26;G01B11/24;G01N21/88;H01L21/60;H01L21/66 主分类号 G01R31/26
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