| 摘要 |
PURPOSE:To facilitate the discrimination of normal from defective by sharpening the X-ray picture-image contrast in the solder bonding part in relation to the title inspection method of electronic device mounted by solder bonding step of the terminals of multiterminal package (e.g. QFP) on the surface of a substrate such as printed board. CONSTITUTION:The solder bonded part of the terminal 2 of a multiterminal package 1 is irradiated with the X-ray transmitting the packaged part 1a of the multiterminal package 1 to throw a light and shade picture-image on the solder bonded part thereby enabling the acceptability of the solder bonding strength in the solder bonded part to be discriminated. |
