METHOD AND APPARATUS FOR COATING WITH SOLDER

摘要

PURPOSE:To provide a solder coating method for preventing adherence of removed solder powder to a surface of a printed circuit board, suppressing oxidation of coated solder surface and further making a thickness of solder coating uniform in the method for coating a pad of the board with solder. CONSTITUTION:In a step of solder coating for dipping a printed circuit board 17 in melted solder liquid 16 poured in a melted solder tank 15 and lifting it, excess solder adhered to one or both sides of the board 17 is sucked to be removed when the board 17 is lifted from the liquid 16 to prevent scattering of the powder and oxidation of the coated solder.