| 摘要 |
Series connected cells of a solar array formed in a monolithic semiconductor substrate are electrically isolated by forming grooves in a first major surface partially through the substrate between cells and then fracturing the substrate from the bottom of the grooves to an opposing major surface. Metallization interconnecting the cells provides physical integrity of the cell array after the fracturing of the substrate. The grooves can be formed prior to completion of fabrication of the cells or after fabrication of the cells. In an array embodiment where each cell extends from one major surface to the opposing major surface, the grooves can be formed in both major surfaces.
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