发明名称 CVD METHOD FOR DEPOSITING A LAYER ON AN ELECTRICALLY CONDUCTIVE THIN LAYER STRUCTURE
摘要 PCT No. PCT/EP89/00126 Sec. 371 Date Jul. 20, 1990 Sec. 102(e) Date Jul. 20, 1990 PCT Filed Feb. 10, 1989 PCT Pub. No. WO89/07665 PCT Pub. Date Aug. 24, 1989.A method for depositing a layer of additional material onto an electrically conductive thin layer structure preferably by means of the thermally induced reason of a compound in the vapor state, in which the thin structure is heated by an electric current passed through it. The method is especially suitable for reinforcing metallic conductor structures which have been made on a substrate by a direct-writing-laser chemical vapor deposition method, for example, fine tungsten wires.
申请公布号 US5164222(A) 申请公布日期 1992.11.17
申请号 US19900548996 申请日期 1990.07.20
申请人 MAX-PLANCK-GESELLSCHAFT ZUR FOERDERUNG DER WISSENSCHAFTEN 发明人 GOTTSLEBEN, OLIVER;STUKE, MICHAEL
分类号 C23C16/04;C23C16/46;C23C16/48;H01L21/28;H01L21/285;H01L21/3205;H01L23/52 主分类号 C23C16/04
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