CURING AGENT COMPOSITIONS, LAMINATING VARNISHES CONTAINING SAME AND LAMINATES PREPARED THEREFROM

摘要

Curing agents for epoxy resins are disclosed which comprise a mixture of a halogen substituted dihydric phenol such as tetrabromobisphenol A and a material having an average of more than two phenolic hydroxyl groups per molecule such as a phenolformaldehyde novolac resin. The curing agents are particularly useful in epoxy resin varnish formulations for preparing prepreg laminating materials for use in electrical and electronic applications.