发明名称 |
Integrated circuit device produced with a resin layer produced from a heat-resistant resin paste |
摘要 |
An integrated circuit device wherein layer insulation is attained by at least one of (i) an insulator layer interposed between two adjacent conductor layers, and (ii) a surface protecting layer fixedly covering the surface of the semiconductor chip, each of the insulator layer and the surface protecting layer being made of a heat-resistant resin obtainable by heating a heat-resistant resin paste. Said paste consists essentially of a first organic liquid, a second organic liquid, a heat-resistant resin (B) which is soluble in an organic liquid mixture consisting of the first organic liquid and the second organic liquid, and fine particles of a heat-resistant resin (C) which is soluble in the first organic liquid but insoluble in the second organic liquid. The first organic liquid, the second organic liquid and the heat-resistant resin (B) are brought into a solution in which the fine particles of a heat-resistant resin (C) are dispersed.
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申请公布号 |
US5164816(A) |
申请公布日期 |
1992.11.17 |
申请号 |
US19910739829 |
申请日期 |
1991.08.02 |
申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
NISHIZAWA, HIROSHI;SUZUKI, KENJI;MUKOYAMA, YOSHIYUKI;KIKUCHI, TOHRU;SATO, HIDETAKA |
分类号 |
H01B3/30;H01L23/29;H01L23/31;H01L23/498;H01L23/532;H05K1/00;H05K3/28;H05K3/46 |
主分类号 |
H01B3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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