| 摘要 |
PURPOSE:To obtain a composition having excellent heat-resistance, soldering cracking resistance, etc., and suitable as a sealing material for semiconductor device by compounding an inorganic filler to an organic component composed of a polymaleimide resin, a specific epoxy compound and a phenolic compound. CONSTITUTION:This composition is produced by compounding (A) an inorganic filler (preferably a mixture of spherical silica powder and amorphous silica powder) to an organic component composed mainly of (B) a polymaleimide compound of formula I (R1 is >=2C m-valent organic group; m>=2) (e.g. N,N'- ethylenebismaleimide), (C) an epoxy compound of formula II or epoxy compounds containing 30-100% compound of formula II and (D) a phenolic compound having plural phenolic hydroxyl groups. The compound of formula II is preferably produced by condensing 2mol of 1,6-dihydroxynaphthalene and 1mol of formaldehyde and reacting the condensation product with epichlorohydrin. The component (D) is preferably a novolak phenolic resin of formula III (R3 is H, OH, etc.; r>=1). |
