| 摘要 |
PURPOSE:To perform a wire bonding at high speed without breaking a chip. CONSTITUTION:In a wire bonding method, in which a wire 2 is inserted in a tool 1 held by a retention member 12, this tool 1 is vertically moved and the lower end part of this wire 2 is bonded on a chip 4, the above wire 2 is made to land on a plurality of points on the above chip 4, the heights of the plurality of these points are detected by a sensor and the inclination of the upper surface of the chip 4 is found on the basis of these heights. |
