| 摘要 |
PURPOSE:To provide a semiconductor device having high reliability and mounting density. CONSTITUTION:A first semiconductor chip 1 is placed on a semiconductor chip placing region 3a of a lead frame 3, a second chip 5 is placed on the chip 1 through an impact buffer sheet 4, and a pad electrode 1a or 1b of the chips 1, 5 are electrically connected to outer leads 3b. Reliability and mounting density can be improved, such that the chips 1, 5 can be lap mounted on one semiconductor device, an impact when the electrode 1b of the chip 5 is connected to a fine metal wiring 6 can be absorbed. |
