发明名称 WAFER SUPPORTING DEVICE
摘要 <p>PURPOSE:To reduce the impact when, for instance, a wafer inside a carrier is pushed up from below for being supported. CONSTITUTION:A wafer holder 3 is so made as able to be lifted by a ball screw or the like and comprises side-receiving parts 5A, 5B respectively guiding both sides of the wafer to be supported and a center receiving part 5C for guiding the center to be supported. An inserting groove 6, into which the wafer is to be inserted, is formed on the respective receiving parts 5A to 5C, the peripheral part of the wafer is so set up so as to reach in the order of the inserting groove 6 of the central receiving part 5C, the inserting grooves 6 of the side receiving parts 5A, 5B. A feed angle (angle to a vertical face of an inner groove surface) of the center inserting groove 6 is made larger than the feed angles of the side inserting grooves 6 and perpendicularity and the longitudinal direction of the wafer are firstly corrected to a certain extent at the lower end (the center) followed by being corrected into a right posture on both sides to be supported.</p>
申请公布号 JPH04323848(A) 申请公布日期 1992.11.13
申请号 JP19910122371 申请日期 1991.04.23
申请人 TOKYO ELECTRON LTD;TOKYO ELECTRON KYUSHU KK 发明人 TOMOE TAKAYUKI;ANAI NORIYUKI;SATO TAKAZO;SHIRAISHI HIROBUMI;HARADA KOJI
分类号 H01L21/304;H01L21/677;H01L21/68 主分类号 H01L21/304
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