| 摘要 |
PURPOSE:To enhance a leadless chip carrier in static breakdown strength. CONSTITUTION:Conductive resin 3 of high resistance is applicd onto a conductor pattern 2 formed on a wiring board 1 through printing, whereby all the conductor patterns 2 of the board 1 are electrically connected to each other through the intermediary of a high resistor to disperse electrostatic charge, and in result, a leadless chip carrier of this design can be enhanced in static breakdown strength. |
