| 摘要 |
<p>PURPOSE:To prevent the presence of a holding pin from affecting the treatment surface of a semiconductor wafer by a method wherein the semiconductor wafer is held taking advantage of its beveled part. CONSTITUTION:A vacuum suction arm 4 which holds a semiconductor wafer 1 and semiconductor wafer holding pins 2 mounted through the intermediary of springs 3 fixed to the suction arm 4 provided. The beveled part 1a of the semiconductor wafer 1 is held as sucked by a sucking hole provided on the suction arm 4 enabling the beveled part 1a provided to the peripheral edge of the semiconductor wafer 1 to be held by the elastic force of the springs 3. A holding mechanism 6 provided with holding pins 5 is provided on the lower part of the arm 4 to support the semiconductor wafer 1 from below. As mentioned above, nothing is provided to cover the surface of the semiconductor wafer 1, so that a uniform film can be formed on a semiconductor wafer, and consequently a normal pellet can be manufactured eliminating conventionally generated pawl-scratched pellet.</p> |
