| 摘要 |
<p>PURPOSE:To make the suction of a wafer desirable by forming a chuck itself with a conductive ceramic. CONSTITUTION:A vacuum chuck for a six-inch wafer is prepared by forming a suction surface with a complicated supporting pattern machined by electric discharge on one side of the body of a disc chuck having a diameter of 140mm made of TiB2, for example. Then, when this vacuum chuck is used in a stepper (aligner) for chucking a silicon wafer, the chuck body presents a high abrasion resistance compared to a vacuum chuck made of aluminum alloy. It also shows less changes in the elapsed time. Hence, an excellent abrasion resistance and the precision required for the suction surface can be maintained for a long time. The suction surface can be easily machined, at the same time making it possible to prevent the adhesion of dust particles to such a surface due to static electricity.</p> |
