| 摘要 |
PURPOSE:To provide a method for reflow soldering an electronic component, in which solderability can be improved by preventing a Manhattan phenomenon in an improvement in the method. CONSTITUTION:A method for reflow soldering an electronic component to solder the component 1 having pads A-B arranged at an approximate distance L separately from one another to an electronic component support 2 in a reflow type while passing it through a heating furnace 4 in one direction is constituted to satisfy an equation TA-TB=TL/V, where TA is a boiling point of solvent of solder paste SA to be used for the pad A to be previously introduced into the furnace, TB is a boiling point of solvent of solder paste SB to be used for the pad B to be introduced later into the furnace, T is a temperature rising speed of the component 1 in the furnace 4, and V is a speed of the component 1 to pass through the furnace 4. |
