| 摘要 |
PURPOSE:To improve the mounting density by installing a plurality of pin- receiving socket pins into which at least one IC pin receiving socket pin longer than the IC pin distance of an integrated circuit and connecting each of them by through holes. CONSTITUTION:After pin receiving socket pins 10, 11 of a second IC socket 9 are inserted into and connected with through holes 12 of a printed substrate 5, the pins 10, 11 are connected each other by soldering. Then, an IC pin 2 of an IC 1 is inserted into the pin 11 of the socket 9 and at the same time an IC pin receiving socket pin 8 of a first IC socket 7 is inserted into the pin 10. A plurality of IC 1 are clinched and mounted in one socket 9 by inserting pin 2 of the IC 1 into the socket 7. Though the pin 2 and the pin 8 to be inserted into the socket 9 are one, respectively, a plurality of IC pin receiving socket pins can be inserted into the second IC socket by differing the distance of a plurality of the pins. |
