| 摘要 |
PURPOSE:To provide a multi-chip module in which many LSI chips of high yield are mounted, in high yield. CONSTITUTION:Surfaces of a circuit board 1 or LSI chips 4, 10 are coated with optically curable insulating resins 3, 12 having 100 megaohms or more of volume resistance at the time of uncuring, the chips 4, 10 are pressurized to bring electrodes of the chips 4, 10 into contact with conductor wirings 2 of the board. The sides of the chips 4, 10 are irradiated with a light in this state, only the optically curable insulating resin of a periphery including the electrodes of the chips 4, 10 is cured to secure the chips to the board 1, the electrodes of the chips are electrically connected to the electrodes of the board by contact, operation tests of the chips are conducted, a defective chip 10 is removed, replaced with a non-defective chip 15, and then uncured part of the resin is cured. Replacement of the defective chip is facilitated, and a multi-chip module of high yield can be obtained. |
