| 摘要 |
The semiconductor chip in the package has a number of soldering points on its plastics lines. There are numerous inner lines of a conductive frame, soldered to the points, which may be of Pb-Sn alloy etc. whose melting temp. is higher than that of the epoxy hardening temp. Each soldering point is typically spherical, with the plastics lines of the chip set along a longitudinal line. Alternatively they are arranged along two such lines. They may be also of zigzag shape. In the mfg., polyimide films are formed on the semiconductor chip surface, and the soldering points are formed on each plastics line. USE/ADVANTAGE - Also for MSP, QFP-type packages, e.g. for memory integrated circuit chips, with improved design reduced package thickness, without using wire bonding process. |
