| 摘要 |
The invention relates to microelectronic and electric engineering. The method comprises the following stages: at the first stage the coating is conditioned at the room temperature during the time interval from 20 sec to 1 hour, depending on the type of the polymer coating; at the second stage, the coating is conditioned at a higher temperature and under a surplus pressure sufficient for suppression of microcrack development within a time interval chosen so as to prevent thermodestruction of the polymer coating at the moment of reaching protective properties; at the third stage, the coating is cooled down to the room temperature. According to the invention, the surplus pressure is applied at the first stage and is continued at the cooling stage. The device comprises a high temperature hermetic chamber (13), connected to a high pressure line (8), provided with windows (14, 15), for charging and discharging of the articles, respectively. The chamber (13) is provided with a heater (24). According to the invention, before the high temperature chamber (13) is mounted a hermetic chamber (1) intended for drying the coating at the room temperature and connected to the chamber (13) and to the high pressure line (8). After the high temperature chamber (13), along the path of the article, is mounted a hermetic chamber (25) intended for cooling the coating and connected to the chamber (13). The invention can be used for production of microcircuits, as well as for applying polymer insulation coatings. |
