发明名称 |
SOLDER LEVELLER |
摘要 |
A horizontal solder leveller includes: solder spurge bars (21, 22) for providing downwardly and upwardly directed, distributed flow of solder, as a spray (25), through which a board (1) being tinned can pass to displace oil from contact pads on the board. |
申请公布号 |
WO9219416(A1) |
申请公布日期 |
1992.11.12 |
申请号 |
WO1992GB00821 |
申请日期 |
1992.05.06 |
申请人 |
LYMN, PETER, PHILIP, ANDREW |
发明人 |
LYMN, PETER, PHILIP, ANDREW |
分类号 |
B23K1/20;B23K3/06;B23K3/08;H05K3/34 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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