| 摘要 |
PURPOSE: To confirm the conduction of a bonding wire, connected between an external pin of integrated circuit and a bonding pad by monitoring the potentials at both ends a metallic conductor connected between the bonding pad and a power source conductor. CONSTITUTION: When a bonding wire 6 is complete and the pin 4 and bonding pad 10 are connected electrically, a current flows to the bonding wire 6 and metallic conductor 14, to generate a potential difference between the both ends, and the potential difference between the bonding pad 10 and power source conductor 18 is not zero, so that a low output signal is generated at an open circuit detection pin 26 to indicate the conduction of the bonding wire 6. If the bonding wire is lost or damaged and no current flows to the metallic conductor 14, the potential difference between the bonding pad 10 and a power source conductor 18 is effectively zero, so that a high output signal of the open circuit detection pin 26 indicates an open circuit of the bonding wire 6. |
