VORRICHTUNG ZUR IDENTIFIKATION VON UNTERSCHIEDLICHEN HALBLEITERSCHEIBEN.

摘要

The device is used to identify the different semiconductor wafers (13,14) within a supply batch, to allow the wafers not belonging to the overall group to be sorted out. It uses a mechanical gauge cooperating with the transported batch, with slits (10) for detecting the different semiconductor wafer thicknesses and/or an IR transmission measuring device, for sorting the wafers in dependence on their band gaps. Pref. the IR transmission measuring device uses optical fibres with their ends inclined at 45 degrees to the optical axis for deflection of the IR radiation through 90 degrees, the different band gaps used to differentiate between gallium arsenide semiconductor wafers and silicon semiconductor wafers.