| 摘要 |
PURPOSE:To provide a manufacturing method for a multilayer printed board which improves adhesion between an inner layer circuit and a plated layer formed in a through hole and avoids defective connection. CONSTITUTION:A manufacture of a multilayer printed board consisting of a process for treatment with a solution including interfacial active agents such as polyethylene glycol, a process which roughens an inner layer circuit after above the stated process, and a process which forms a plated layer in a through hole by electroless plating after the last process. The treating with a solution including interfacial active agent improves leakage characteristics, and through the roughening process after that, roughening solution can come into a through hole easier to effectively roughen the inner layer circuit. Since the solution which includes interfacial active agent can not easily come into a through hole, the interfacial active agent rarely sticks to the inner layer circuit to improve adherence to the plated layer. Therefore, the connection between the inner layer circuit and the plated layer becomes better. |
