发明名称 THIN FILM COATING DEVICE OF SEMICONDUCTOR WAFER
摘要 PURPOSE:To obtain a uniform thin film through the effectie use of an anchor reinforcing agent by a method wherein the vapor of the anchor reinforcing agent and a mixed gas of compressed gas are injected into a wafer. CONSTITUTION:The compressed gas is introduced in a vessel 3, the anchor reinforcing agent 5 is heated to cause vapor to be promoted and the mixed gas is discharged 2 and injected into the wafer 8 through a nozzle 7. The wafer 8 is adsorbed to and rotated by means of a motor 10 to be coated for forming a thin film. A valve 13 regulates a pressure and electromagnetic valves 12, 12' and flow control valves 11, 11' control the injection and displacement of the compressed gas and mixes gas respectively and control a film tickness. With this construction, since the expensive anchor reinforcing agent can effectively be utilized, it is economical, and the film thickness control can be performed easily and in high precesion.
申请公布号 JPS5685825(A) 申请公布日期 1981.07.13
申请号 JP19790163775 申请日期 1979.12.17
申请人 NIPPON ELECTRIC CO 发明人 OKAMURA MINORU
分类号 H01L21/027;B05C11/08;G03F7/16;(IPC1-7):01L21/30 主分类号 H01L21/027
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