| 摘要 |
PURPOSE:To provide a semiconductor device which can prevent the rise of an internal pressure due to the thermal expansion of a gellike filler filled into a case and which can prevent moisture from being absorbed from the outside. CONSTITUTION:At a semiconductor device, a gellike filler 7 is filled into a package case 5 in which a semiconductor element 3 and an external extraction terminal 4 have been assembled in such a way that the semiconductor element is buried in the lower-part region at its inside, and, in addition, a sealing resin 8 such as an epoxy resin or the like is filled and hardened. At the semiconductor device, an internal-pressure absorbing chamber 9 as a pocket-shaped hermetically sealed space which passes the sealing resin and which is opened on the surface side of the gellike filler is partitioned at the inside of the case. When the gellike filler is expanded with a heat cycle, the internal-pressure absorbing chamber absorbs the increased portion of its volume, prevents the leak of a gel and prevents a stress exterted on the semiconductor element. The inner-pressure absorbing chamber as a closed space prevents that the gel absorbs moisture from the outside, and ensures its intrinsic moistureproofness. |
