发明名称 |
Method for low temperature bonding of silicon and silicon on sapphire and spinel to nickel and nickel steel and apparatus using such a bonding technique |
摘要 |
A method for low temperature bonding of silicon and silicon on sapphire and spinel to nickel and nickel steel using a layered structure with an aluminum interface between the nickel or nickel steel and the silicon. The bonding is achieved in a reducing atmosphere using a temperature of 640 to 650 degrees C. with a pressure of 100 to 150 psi on the layered structure for a period of approximately five minutes with a subsequent cooling to avoid strains in the bond. An example of the transducer apparatus utilizing such a bonding technique includes a nickel steel housing and a silicon on spinel transducer wafer having a silicon peripheral pad with an aluminum layer bonding the silicon pad to the nickel steel housing.
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申请公布号 |
US4278195(A) |
申请公布日期 |
1981.07.14 |
申请号 |
US19780965350 |
申请日期 |
1978.12.01 |
申请人 |
HONEYWELL INC. |
发明人 |
SINGH, GURNAM |
分类号 |
B23K35/00;B23K35/28;C03C27/00;H01L21/60;(IPC1-7):B23K35/28;H05K5/06 |
主分类号 |
B23K35/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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