| 摘要 |
PURPOSE:To provide a mold for transfer mold capable of simplifying processes in TAB technique. CONSTITUTION:In an upper mold 2, lead cutting blades 24 are provided on the parts corresponding to lead cutting slits 46 formed in a TAB tape. In a lower mold, groove-like receiving parts 28 are formed which act to receive the lead cutting blades 24 at the positions opposite to the lead cutting blades 24 provided on the upper mold 2. After the completion of resin sealing work for an IC chip, by pressing down the lead cutting blades 24 by means of the mold for transfer mold while holding the TAB tape, respective leads 36 on the lead cutting slits 46 are punched out. |
