| 摘要 |
PURPOSE:To provide a simpler method of manufacturing a multilayered high- density wiring structure which has wiring layers strong enough to prevent breaks and prevents short circuits between adjacent layers, and also which can be repaired even if wiring layers include discontinuities or poor connections. CONSTITUTION:A multilayered wiring structure includes a wiring substrate 1, a first wiring layer 2 formed on the substrate 1, a second wiring layer 3 in the form of an air bridge above the first wiring layer 2, an insulating film 4 under the second wiring layer 3, and a metallic layer 5 formed over the surface except under the second wiring layer. |
