| 摘要 |
Metal coated ceramic particles are bonded to a metallic substrate (12) in a high temperature sintering process. A low viscosity binder solution containing fine metallic particulates (16) is first applied to the substrate surface. Then, the coated ceramic particles (18) are disposed upon the substrate surface, and the binder solution and the metal particulates (16) therein are attracted by capillarity into regions of point contact between the ceramic particles (18) and the substrate surface. During a subsequent high temperature sintering operation, the metal coating on the ceramic particles (18) diffuses into the metal substrate (12), and the metallic particulates (16) melt and solidify to bridge the gap between the substrate (12) and ceramic particles (18). |
