SUBSTRATE SOLDERING METHOD USING REDUCING ATMOSPHERE AND SOLDERING TEMPLATE,申请号JP19920034775-传众专利搜索

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发明名称	SUBSTRATE SOLDERING METHOD USING REDUCING ATMOSPHERE AND SOLDERING TEMPLATE
摘要
申请公布号	JPH04320056(A)	申请公布日期	1992.11.10
申请号	JP19920034775	申请日期	1992.02.21
申请人	INTERNATL BUSINESS MACH CORP <IBM>	发明人	JIYOSEFU ANSONII APAPU;MAAKU ARAN BURAUN;ARAN JIEEMUZU EMERITSUKU;TOOMASU ROURENSU MIRAA;JIEEMUZU RICHIYAADO MAAREI;DEEBITSUDO UIRIAMU SHISENSUTAIN JIYUNIAA
分类号	H01L23/50;H01L21/48;H05K1/03;H05K3/34	主分类号	H01L23/50
代理机构		代理人
主权项
地址

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