发明名称 |
IC package for high-speed semiconductor integrated circuit device |
摘要 |
A tape-automated bonding substrate or TAB substrate used for mounting a gallium arsenide IC chip having external connection terminals including signal input and output terminals thereon is shown. Conductive thin-film wiring lines are formed on an insulative thin-film layer. These thin-film wiring lines include feed-through type signal input wiring lines to be connected to the input terminals of the chip. Each feed-through type signal input wiring line has an inner lead to which a corresponding signal input terminal of the chip is directly connected, a terminal pad for receiving a high-speed input signal, and a terminal pad to which an impedance-matching resistor is to be connected. The feed-through type signal input wiring lines have a composite line structure of micro-strip signal transmission and co-planar signal transmission line structures. |
申请公布号 |
US5162896(A) |
申请公布日期 |
1992.11.10 |
申请号 |
US19910652371 |
申请日期 |
1991.02.07 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
TAKUBO, CHIAKI;SAITO, KAZUTAKA;SUDO, TOSHIO |
分类号 |
H01L23/495;H01L23/64;H05K1/02;H05K1/11 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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