| 摘要 |
<p>PURPOSE:To facilitate the remodeling work by the connection shift of i/o signals in a substrate, and shorten the length of the propagation path of those i/o signals to the utmost. CONSTITUTION:This is equipped with first and second pads, which are arranged on the mounting face 1A of a substrate 1, a third pad 13, which is arranged on the mounting face 1A of the substrate 1 by being connected to the first pad 11, a first in-layer pattern 21, which is connected to the first pad 11 by a surface pattern 17, and a second in-layer pattern 22, which is made to oppose the third pad 13 and is connected to the second pad 12. As occasion demands, the specified place of that surface pattern is cut, and also a through hole 4 is processed, which exposes the second in-layer pattern 22 by piercing the third pad 13 and the insulating layer 2, and the third pad 13 and the second in-layer pattern 22 are connected by a stud pump 6 by fixing the stud bump 6 to the third pad 3 and passing the through hole 5.</p> |
