| 摘要 |
PURPOSE:To obtain a semiconductor integrated circuit device testing device capable of easily and accurately executing tests and specifying a concrete fault position. CONSTITUTION:A secondary electron image detecting means 11 irradiates a semiconductor integrated circuit device to be tested with electron beams while applying a test pattern to the tested device and outputs a secondary electron image 20 obtained by extracting projected secondary electrons as image information. On the other hand, an output expecting pattern image forming means 12 outputs an output expecting pattern image 30 obtained by writing an output expecting pattern corresponding to a test pattern in a position corresponding to the I/O of respective elements in the image 20. An image processor 13 collates the image 20 with the image 30 and outputs the collated result 40 as a test result. Consequently a concrete fault position can easily be detected and easily be tested by inspecting an internal signal of the semiconductor integrated circuit device and an accurate test can be attained by noncontact inspection. |
