发明名称 ELECTRONIC PARTS
摘要 <p>PURPOSE:To prevent a bleeding-out phenomenon from being produced in the case where a conductor film is narrowed in its width for the purpose of high density wiring. CONSTITUTION:When a width size of a conductor film 2A corresponding to a portion of the same where a resistor film 3 is provided is assumed to be L, a width size T of an overlapped portion between the conductor film 2A and the resistor film 3 is set to lie substantially within 0.1 L to 0.3 L. Hereby, the fine pattern conductor film 2A can be formed with ease without causing production of a bleeding-out phenomenon.</p>
申请公布号 JPH04320001(A) 申请公布日期 1992.11.10
申请号 JP19910113923 申请日期 1991.04.18
申请人 TDK CORP 发明人 IGARASHI KATSUHIKO;MIYAUCHI TAIJI;KAMIYA TAKASHI;KAWAMURA KEIZO
分类号 H01C1/14;H01C7/00;H05K1/16 主分类号 H01C1/14
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