| 摘要 |
An apparatus for etching disks such as silicon chips or wafers incorporating a carrier (1) for the disk, in the upper surface (9, 10) of which adjacent the disk (11) is an annular nozzle (8) through which compressed gas can be led to form a gas cushion between the carrier (1) and the disk (11), the gas escaping between the disk (11) and carrier (1) preventing processing liquids from reaching the lower side of the disk (11). The carrier (1) is arranged within the inner chamber (21) of an annular pot (20) within which at least two annular channels (25, 26, 27) open to the inner chamber. There are devices to raise and lower the carrier (1) relative to the pot (20) and to rotate the carrier (1) about its axis (14) coinciding with the midline axis of the pot (20). |
