| 摘要 |
PURPOSE:To reduce dimensional change at the time of processing a circuit and forming a multilayered laminated layer by heat treating an inner layer plate at a higher temperature by a specific temperature than the temperature of forming the layer before the plate is circuit-processed. CONSTITUTION:A glass fiber based epoxy resin both-side copper-plated laminated board is used as a sample, heat treated at a higher temperature by 20 deg.C or higher than the temperature of forming a laminated layer, i.e., 190-210 deg.C, a circuit is processed, and the copper foil surface of the circuit is oxidized. Then, a 6-layer board is, for example, manufactured by the thus formed inner layer plate. For example, two glass fiber-based epoxy resin prepregs 4 are interposed between the two inner layer plates 1 and 2, glass fiber-based epoxy resin prepregs 4 are disposed on the upper side of the plate 1 and on the lower side of the plate 2, and a one-side copper-plated plate 3 is disposed. After this combination structure material is heated and pressurized at 170 deg.C, it is cooled to obtain a 6-layer board. Thus, residual strain of the inner layer plate can effectively be removed, and curing reaction of the inner layer plate resin layer can be accelerated. |
