LEAD FRAME OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF ASSEMBLING SEMICONDUCTOR INTEGRATED CIRCUIT USING SAID LEAD FRAME,申请号JP19910082103-传众专利搜索

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发明名称	LEAD FRAME OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF ASSEMBLING SEMICONDUCTOR INTEGRATED CIRCUIT USING SAID LEAD FRAME
摘要
申请公布号	JPH04315443(A)	申请公布日期	1992.11.06
申请号	JP19910082103	申请日期	1991.04.15
申请人	HITACHI LTD	发明人	NAKAGAWA KIYOSHI;INOUE HAJIME;YAMADA SHINICHI;NAKAGOME HIDEAKI
分类号	H01L21/50	主分类号	H01L21/50
代理机构		代理人
主权项
地址

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