发明名称 METHOD AND DEVICE FOR SOLDERING COMPOSITE ELECTRONIC PART
摘要 PURPOSE:To prevent thermal deformation, etc., of a synthetic resin member in the soldering method of a composite electronic parts having a metallic member and the synthetic resin member. CONSTITUTION:The composite electronic part 12 having the synthetic resin member 20 and the metallic member 22 is placed on a conveyor belt 14 having ventilation and electronic parts 24 are mounted on the composite electronic part 12 via solder. The focus of a focus type near infrared heater 18 is adjusted on this soldering part and the solder is heated by the focus type near infrared heater 18 to perform soldering. Air is blown off from a blowoff port 28 toward the composite electronic part 12 which is air-cooled. When the soldering method and device for the composite electronic part of this invention are used, the composite electronic part consisting of the metallic member and the synthetic resin member can be soldered with high accuracy with simple equipment. Since the soldering method and device have high mass productivity, an effect of cost reduction is also great and these are useful industrially.
申请公布号 JPH04313459(A) 申请公布日期 1992.11.05
申请号 JP19910077739 申请日期 1991.04.10
申请人 MITSUBISHI MATERIALS CORP 发明人 TSUCHIDA TAKESHI;KODAIRA TOSHIAKI;KOJIMA YASUSHI
分类号 B23K1/005;B23K31/02;B23K101/36 主分类号 B23K1/005
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