| 摘要 |
<p>PURPOSE:To provide a TAB tape capable of an improvement of reliability when an IC chip is grounded and resin-sealed. CONSTITUTION:A ground plate 20 is allowed to stick to the back of an IC chip 2 using a conductive adhesive. Three legs 22 of the ground plate 20 are led out onto corner ends within a resin sealing region, and interconnected using a grounding lead 16 and a solder 32.</p> |
