摘要 |
PURPOSE:To offer the laser hole machining device which can improve surely the efficiency for hole working, and also, does not cause deterioration of the hole quality. CONSTITUTION:The device is provided with a laser beam oscillator 1 for oscillating a laser beam, plural reflecting members 8A-8C which are provided in a state that they are placed in series on an irradiation optical axis 13 from this laser oscillator 1 and by rotating them a state that the laser beam radiated to each of them is subjected to total reflection and a state that it is allowed to transmit through are switched, driving means 7A-7C for driving to rotate independently each reflecting member 8A-8C, and a supporting means 12 for supporting objects to be worked 15A-15D in a state positioned on working optical axes 17A-17D of the laser beam subjected to total reflection by each reflecting member 7A-7C. |