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发明名称
DIE BONDING APPARATUS AND METHOD
摘要
申请公布号
JPH04312956(A)
申请公布日期
1992.11.04
申请号
JP19910064409
申请日期
1991.03.28
申请人
MITSUBISHI ELECTRIC CORP
发明人
KANDA MAKOTO;YAMAMOTO MASAHIKO
分类号
H01L21/301;H01L21/52;H01L21/78
主分类号
H01L21/301
代理机构
代理人
主权项
地址
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