| 发明名称 |
SEMICONDUCTOR LASER CHIP WITH A HEAT SINK |
| 摘要 |
<p>Arrangement of a semiconductor laser chip and an associated heat sink (8), where the mirror end surfaces (2) of the laser resonator are etched and parts of the etching mask are formed as this heat sink (8) and remain on the chip. <IMAGE></p> |
| 申请公布号 |
EP0330837(B1) |
申请公布日期 |
1992.11.04 |
| 申请号 |
EP19890101291 |
申请日期 |
1989.01.25 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
WESTERMEIER, HEINZ, DIPL.-ING. (FH) |
| 分类号 |
H01L33/64;H01S5/02;H01S5/024;H01S5/028 |
主分类号 |
H01L33/64 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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